Low profile interconnect for light emitter

ABSTRACT

In some embodiments, an interconnect electrical connects a light emitter to wiring on a substrate. The interconnect may be deposited by 3D printing and lays flat on the light emitter and substrate. In some embodiments, the interconnect has a generally rectangular or oval cross-sectional profile and extends above the light emitter to a height of about 50 μm or less, or about 35 μm or less. This small height allows close spacing between an overlying optical structure and the light emitter, thereby providing high efficiency in the injection of light from the light emitter into the optical structure, such as a light pipe.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.17/671,477, filed on Feb. 14, 2022, entitled LOW PROFILE INTERCONNECTFOR LIGHT EMITTER. U.S. application Ser. No. 17/671,477 is a divisionalapplication of U.S. application Ser. No. 15/441,074, filed Feb. 23,2017, LOW PROFILE INTERCONNECT FOR LIGHT EMITTER. U.S. application Ser.No. 15/441,074 is a nonprovisional of and claims the benefit of priorityunder 35 U.S.C. § 119(e) of U.S. Provisional Application No. 62/299,163,filed on Feb. 24, 2016, entitled LOW PROFILE INTERCONNECT FOR LIGHTEMITTER. This application claims priority, and incorporates byreference, each of U.S. application Ser. No. 17/671,477, U.S.application Ser. No. 15/441,074, and U.S. Provisional Application No.62/299,163.

This application also incorporates by reference the entirety of each ofthe following patent applications and publications: U.S. applicationSer. No. 14/555,585 filed on Nov. 27, 2014; U.S. application Ser. No.14/690,401 filed on Apr. 18, 2015; U.S. application Ser. No. 14/212,961filed on Mar. 14, 2014; and U.S. application Ser. No. 14/331,218 filedon Jul. 14, 2014.

BACKGROUND Field

The present disclosure relates to light sources and, more particularly,to light sources with light emitters mounted on substrates. In someembodiments, the light emitters may be light emitting diodes.

Description of the Related Art

Light emitters mounted on substrates, such as light emitting diodesmounted on circuit boards, are used as light sources to provideillumination in various electronic devices. The substrates may includewire bonds that connect the light emitters with wiring on thesubstrates, to provide power to the light emitters. As thespecifications for modern devices change, e.g., as requirements forefficiency, robustness, and/or compactness increase, there is acontinuing need to develop light sources that can meet the needs ofthese modern devices.

SUMMARY

In some embodiments, an illumination system is provided. Theillumination system comprises a substrate comprising a substrate bondpad. A light emitter is attached to the substrate, and the light emittercomprises a light emitter bond pad. An electrical interconnect is overthe light emitter. The electrical interconnect contacts the lightemitter bond pad at one end of the electrical interconnect and contactsthe substrate bond pad at an other end of the electrical interconnect.The cross-sectional shape of the electrical interconnect, as viewed in aplane traverse to an elongate axis of the electrical interconnect, has awidth larger than a height. A maximum height of the electricalinterconnect above the light emitter may be 50 μm or less in someembodiments. The electrical interconnect may conformally follow contoursof the light emitter in some embodiments.

In some other embodiments, a method for making an illumination device isprovided. The method comprises providing a light emitter, comprising alight emitter bond pad, over a substrate comprising a substrate bondpad. The method further comprises depositing an electrical interconnectover the light emitter and in contact with the light emitter bond padand the substrate bond pad. Depositing the electrical interconnect maycomprise 3D printing the electrical interconnect in some embodiments.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates an example of a cross-sectional side view of a wirebond connecting a light emitter to a bond pad on a substrate.

FIG. 2A illustrates an example of a cross-sectional side view of a lightsource having a light emitter connected to a substrate by a low-profileinterconnect.

FIG. 2B illustrates an example of a cross-sectional view of the lightsource of FIG. 2A, as seem in a cross-section taken along the plane2B-2B of FIG. 2A.

FIG. 3 illustrates an example of a cross-sectional side view of a lightsource having a dielectric layer underlying a low-profile interconnect.

FIG. 4 illustrates another example of a cross-sectional side view of alight source having a dielectric layer underlying a low-profileinterconnect.

FIG. 5 illustrates an example of a cross-sectional side view of thelight source of FIG. 4 having a light pipe over the light emitter.

FIG. 6 illustrates an example of a cross-sectional side view of thelight source of FIG. 5 having an encapsulating material over the lightemitter and a light pipe over the encapsulating material.

FIG. 7 is a plot showing the power efficiency of a light pipe as afunction of distance between the light pipe and a light emitter.

FIG. 8 illustrates a user's view of augmented reality (AR) through an ARdevice.

FIG. 9 illustrates an example of wearable display system.

FIG. 10 illustrates a conventional display system for simulatingthree-dimensional imagery for a user.

FIG. 11 illustrates aspects of an approach for simulatingthree-dimensional imagery using multiple depth planes.

FIGS. 12A-12C illustrate relationships between radius of curvature andfocal radius.

FIG. 13 illustrates an example of a waveguide stack for outputting imageinformation to a user.

FIG. 14 illustrates an example of exit beams outputted by a waveguide.

FIG. 15 illustrates a perspective view of a light module having aplurality of light emitters and a plurality of light collectors.

It will be appreciated that the drawings are provided to illustrateexample embodiments and are not intended to limit the scope of thedisclosure. Like reference numerals refer to like features throughout.

DETAILED DESCRIPTION

Light emitters may be coupled to overlying optical structures (e.g.,light pipes) that receive light from the light emitters to, e.g.,further transmit that light and/or to modify the light. It will beappreciated that the efficiency of the injection of light from the lightemitter into the optical structures is strongly dependent on thedistance separating the light emitter and the optical structure. Smallerseparations provide higher efficiencies, with a higher percentage of theemitted light being injected into the optical structures. The impact ofsmaller separations can increase with decreases in the widths ortransverse dimensions of the optical structures and light emitters; as atransverse dimension decreases, more power is lost around the edges bylight missing the optical structure. For example, where the opticalstructure and light emitter dimensions in transverse directions aresmaller than 1.5 mm, the impact of the separation on efficiency isreadily apparent. Thus, the impact of the separation, between a lightemitter and an optical structure that receives light from the lightemitter, increases as the cross-sectional areas of the surfaces of thelight emitter and optical structure decrease.

As noted above, power may be provided to light emitters using wirebonds. Conventional wire bonds, however, have been found to limit howclosely overlying optical structures can be spaced from the lightemitters. FIG. 1 illustrates an example of a cross-sectional side viewof a light source 500 having a wire bond 502 connecting a light emitter510 to a bond pad 520 on a substrate 530. An electrical contact 540provides a second connection between the light emitter 510 and wiring(not shown) in the substrate 530. It will be appreciated that the wirebond 500 and the electrical contact 540 are electrical interconnects andmay function as cathodes and anodes for supplying power to the lightemitter.

Wire bonds are typically metallic wires with circular cross sections. Asillustrated, these wires may gently curve upwards and then downwards tothe bond pad to, e.g., prevent breakage that may be caused by makingsharp corners with the wires. The upward curvature adds to the height ofa light source that includes the wire bond. In addition, the wire hasbeen found to be undesirable for display systems, since it may blocklight from light emitter and form a shadow that may cause a visualartifact in a projected image. The wire bond may also limit how closelyadjacent light emitters can be placed onto the substrate, as the wirebond must have a certain loop height above the chip and cannot curvedownwards too sharply. In addition, an encapsulating material 550 may beformed around the wire bond 502 and light emitter 510, to providemechanical protection and electrical insulation for the wire bond 502and the light emitter 510. The encapsulating material 550 further addsto the height of the light source 500, thereby spacing any opticalstructures from the light emitter 510 by at least the height of theencapsulating material 550, which in turn has a height dictated by thewire bond 502. [

Advantageously, according to some embodiments, light emitters havingexceptionally low profile electrical interconnects are provided. In someembodiments, the interconnects connect a light emitter to bond pads on asubstrate. A single light source may include one, or two or moreinterconnects, each connected to bond pads. The interconnects may have across-sectional profile that, as viewed head on, has a width that islarger than a height, e.g., the profile may be generally rectangular oroval-shaped. Preferably, the interconnect is formed by deposition, e.g.,by a printing process such as 3D printing, which forms a strip ofmaterial over the light emitter. It will be appreciated that the strip,as deposited, has a generally rectangular or oval-shaped cross-section.In some embodiments, a dielectric layer is formed on the light emitterand then the interconnect is deposited. Both the dielectric and theinterconnect may be deposited by the same type of deposition, e.g., bothmay be deposited by 3D printing.

The deposited interconnect may conformally follow the contours of theunderlying surface topology, e.g., the contours of the light emitter andany other structures on the substrate, and this topology may be assumedby the conformal dielectric layer, where such a dielectric layer isdeposited. In some embodiments, both the interconnect and dielectriclayer are strips of material. It will be appreciated that the substratescan include any material that can support electrical circuits, such asstandard FR4, ceramic, metallic and combinations thereof.

Advantageously, the interconnect lays flat over the light emitter,thereby protruding only a small amount above the light emitter. In someembodiments, the interconnect connects to a bond pad on top of the lightemitter and proximate the edge of light emitting area or outside oflight emitting area, which can have advantages for reducing shadow-typeartifacts in a projected image. In some embodiments, the interconnectextends above the light emitter to a height of about 50 μm or less,about 35 μm or less, about 25 μm or less, or about 20 μm or less. Thissmall height allows close spacing between an overlying opticalstructure, e.g., light pipes or reflectors, and the light emitter,thereby providing high efficiency in the injection of light from thelight emitter into the optical structure. In some embodiments, becausethe interconnect lays directly on an underlying material, such as on adeposited dielectric layer, the interconnect may be sufficientlymechanically and environmentally stable to omit use of an encapsulatingmaterial. This avoidance of the encapsulating material may provideadvantages for simplifying manufacturing and reducing manufacturingcosts, while also allowing a closer spacing of an overlying opticalstructure to the light emitter. In addition, directly forming theinterconnect in contact with the substrate surface provides a morerobust and shock and vibration-resistant interconnect than a thin bondwire suspended above the light emitter and substrate.

Reference will now be made to the drawings, in which like referencenumerals refer to like parts throughout.

With reference now to FIG. 2A, an example is illustrated of across-sectional side view of a light source 600 having a light emitter610 connected to a bond pad 620 on a substrate 630 by a low-profileinterconnect 640. As illustrated, the light emitter 610 may also have abond pad 650 to which the interconnect 640 makes direct contact. Thus,the interconnect 640 makes an electrical connection between the bond pad620 in the substrate 630 and the bond pad 650 on the light emitter 610.In some embodiments, an electrical contact 660 under the light emitter610 makes another electrical connection to the light emitter 610. One ofthe interconnect 640 and the electrical contact 660 may function as ananode and the other of the interconnect 640 and the electrical contact660 may function as a cathode to provide power to the light emitter 610.

It will be appreciated that the bond pads 620 and 650 may be areas ofconductive material on or in the light emitter 610 and substrate 630,respectively, to which the interconnect 640 can make a stable electricalcontact. In some embodiments, the bond pads 620 and 650 are deposits ofmaterial on the light emitter 610 or the substrate 630. Preferably, thebond pads 620 and 650 are formed of metallic material. In someembodiments, the bond pad 620 may be part of wiring on the substrate630, such as wiring for providing power to the light emitter 610 and mayalso help to remove heat in some applications, and may have a largerwidth than the wiring. In some embodiments, the substrate 630 may be aprinted circuit board. The wider interconnect 640 may have a lowerheight or thickness than a wire bond but actually help remove more heatthan a wire bond due, e.g., to its larger area, which may allow theinterconnect to function as a heat sink. This is advantageous as heat isdetrimental to light emitter performance and lifespan.

In some embodiments, the light emitter 610 is a light emitting diode(LED) device, such as a LED chip. In some embodiments, the LED is formedby a semiconductor having p and n-doped regions that form a p-n junctionthat emits light upon the application of a voltage across the junction.

With continued reference to FIG. 2A, the interconnect 640 may be formedby a deposition process. In some embodiments, the deposition process maybe a 3D printing process. Advantageously, 3D printing allows for theselective deposition of material at particular locations, and thedeposition may be conformal to facilitate a low height. The 3D printingprocess may include various processes capable of depositing a continuouslayer of conductive material. In some embodiments, the material is ametal. Non-limiting examples of metals include aluminum, gold, andcopper. In some embodiments, the width and thickness of the interconnectcan be varied along its length for desired mechanical fit or electricalor thermal performance.

Non-limiting examples of 3D printing processes include materialextrusion and powder bed fusion. In material extrusion, a supply ofmaterial (e.g., a metal) is melted and flowed out of an opening (e.g.,an opening in a nozzle) to deposit the interconnect material on asurface. In some embodiments, multiple lines of material may bedeposited directly neighboring one another, at the side of another rowof material, to increase the width of the deposited interconnect 640 andto increase the amount of deposited material as desired. In addition oralternatively, the lines may be deposited on top of one another toincrease the thickness of the deposited interconnect 640.

In powder bed fusion, a loose bed of material (e.g., a bed of metalpowder or particles) is selectively heated by a heat source to form acontinuous mass of material at the locations of the applied heat, whilethe unheated portions of the bed remain in powder or particle form andmay be subsequently removed. In some embodiments, the heat source may beany heat source capable of supplying sufficient localized energy tosinter or melt the material, thereby forming a solid mass of material todefine the interconnect 640. Examples of heat sources include devicesthat can project a beam of high-energy radiation or particles to the bedof material. For example, the heat sources may be lasers and/or electronbeams. In some embodiments, the high-energy beam (e.g., a beam withsufficient energy to sinter or melt particles in the bed of material)may be scanned over the bed of material, thereby sintering or meltingthe particles together, to form a continuous line of material. Inaddition, the high-energy beam may be further scanned across the bed ofmaterial to form neighboring lines, to extend the width of theinterconnect 640 to increase the amount of deposited material. In someembodiments, another bed of material may be deposited over the sinteredor melted material, and then exposed to the high-energy beam to increasethe height of the deposited interconnect either generally, or atspecific locations (such as to extend the interconnect up a side of awall). In addition to the processes above, other 3D printing processesfor depositing dielectric materials may also be used to form thedielectric layer 670.

It will be appreciated while referred to as lines of material, thematerial deposited by 3D printing extends linearly in some embodiments,but may form a curve or make a turn in some other embodiments, as viewedin a top down view. In addition, as seem in FIG. 2A, the interconnect640 is deposited conformally on the light emitter 610 and the substrate630; that is, as seem in a side view, the profile of the interconnect640 may conform to and track the profile of the underlying light emitter610 and substrate 30.

As noted herein, the interconnect 640 may supply power to the lightemitter. It will be appreciated that the resistance of the interconnect640 will decrease with increases in the head-on cross-sectional area ofthe interconnect 640 (that is, the cross-sectional area of theinterconnect 640 transverse to the length dimension of the interconnect640 extending from the bond pad 620 to the bond pad 650, which mayinclude the cross-sectional area taken along the plane 2B-2B). As aresult, the number of lines of material deposited to form theinterconnect 640 is preferably chosen to provide a sufficiently largecross-sectional area to provide power to the light emitter 610 withoutundue resistance or heat generation.

In some embodiments, the interconnect 640 may have an elongatedcross-section. FIG. 2B illustrates an example of a cross-sectional viewof the illumination system of FIG. 2A, as seen in a cross-section takenalong the plane 2B-2B of FIG. 2A. The plane 2B-2B is traverse to anelongate axis of the interconnect 640 (e.g., traverse to the axis alongwhich the interconnect 640 extends from the bond pad 620 to the bond pad650); the view illustrated in FIG. 2B may be considered to be the viewof the interconnect 640 as seem head on. As illustrated, theinterconnect 640 has a width W and a height H. In some embodiments, W islarger than H, which can have advantages for providing a low-profileinterconnect, while also allowing sufficient material to achieve adesirably low resistance. In some embodiments, W is larger than H by afactor of about 1.5 or more, 50 or more, or 100 or more.

It will be appreciated that the light emitter 610 and/or the substrate630 may have conductive materials within them or on them. For example,where the light emitter is a LED chip, the light emitter 610 may beformed of a semiconductor die, which can conduct electricity. In someembodiments, the substrate 670 may include conductive features, such aswire traces or a bond pad for the electrical contact 660 that extendsbeyond the light emitter 660. For example, this arrangement may be foundin some ceramic circuit boards. To prevent undesired contact or shortingof the interconnect 640 with other conductive features, a dielectriclayer may be formed along the path of the interconnect 640 beforedepositing that interconnect 640. FIG. 3 illustrates an example of across-sectional side view of the light source 600 having a dielectriclayer 670 underlying a low-profile interconnect 640. In someembodiments, the dielectric layer 670 may be a strip of material thattraces the path of the interconnect 640, and that is wider than andextends beyond the sides of the interconnect 640. In some otherembodiments, the dielectric layer 670 may be a blanket layer ofdielectric overlies portions of the substrate 630 and the light emitter610.

In some embodiments, the dielectric layer 670 may be deposited by 3Dprinting. The 3D printing process for depositing the dielectric layer670 may include various processes capable of depositing a continuouslayer of dielectric material. Non-limiting examples of dielectricmaterials include epoxies, resins, glues, plastics, polycarbonates, andother polymer based materials.

Non-limiting examples of 3D printing processes include materialextrusion, powder bed fusion, material jetting, binder jetting. Materialextrusion and powder bed fusion may be similar to that described abovefor deposition of the interconnect 640, except that a dielectricmaterial may be deposited instead of a conductive material. Materialjetting may be performed by jetting droplets or liquid streams ofmaterial out of a nozzle and then hardening that material by theapplication of energy (e.g., heat and/or light). Binder jetting may beperformed by applying a powder on a surface and jetting droplets orliquid streams of binder material out of a nozzle on the powder to bindthe powder together. In addition to the processes above, other 3Dprinting processes for depositing dielectric materials may also be usedto form the dielectric layer 670.

It will be appreciated that the dielectric layer 670 may extend overparts of one or both of the bonds pads 620 and 650. FIG. 4 illustratesan example of a cross-sectional side view of the light source 600 havingthe dielectric layer 670 underlying the interconnect 650 and also partlyoverlying the bond pads 620 and 650. As illustrated, an end 670 a of thedielectric layer 670 overlies a portion of the bond pad 620 and an end670 b of the dielectric layer 670 overlies a portion of the bond pad650. In some embodiments, the dielectric layer 670 lies conformally overthe substrate 630, the light emitter 610, and the bond pads 620 and/or650. In turn, the interconnect 640 conformally follows the contours ofthe light emitter 610 and the bond pads 620 and 650. As illustrated, theinterconnect 640 may directly contact the dielectric layer 670, inaddition to directly contacting the bond pads 620 and 650. In someembodiments, the dielectric layer may be transparent or partlytransparent to the light emitted by the light emitter 610 and thus coverall or portions of the light emitter without significantly blocking theemitted light.

The low profile of the interconnect 640 allows small spacing between thelight emitter 610 and an overlying structure. FIG. 5 illustrates anexample of a cross-sectional side view of the light source 600 having anoptical structure 680 over the light emitter 610. In some embodiments,the optical structure 680 is a light collection structure such as alight pipe. The light emitter 610 is configured to inject light into theoptical structure 680 through a gap 690. In some embodiments, the heightof the gap 690, or the distance separating the optical structure 680from the light emitter 610, is about 150 μm or less, about 50 μm orless, about 25 μm or less, or about 20 μm or less. In some embodiments,the light emitter 610 may be exposed, with a gap 690, filled with air,separating the light emitter 610 from the optical structure 680.

In some other embodiments, a material other than air may fill the gap690. For example, a transparent adhesive or resin may fill the gap.Preferably, the material filling the gap may be formed of a materialwith a refractive index that substantially matches the refractive indexof the material of the optical structure 680, where the opticalstructure 680 is a light pipe.

It will be appreciated that the light pipe is formed of an opticallytransmissive material and may be used to transmit light. Non-limitingexamples of optically transmissive materials include poly(methylmethacrylate) (PMMA) and other acrylics, glass, polycarbonate, or anyother optical grade polymeric material. Light injected into the lightpipe 680 may propagate through the light pipe by total internalreflection (TIR). In some embodiments, TIR is facilitated by providing alow refractive index material at the sides of the light pipe. Forexample, the low index material may be air or a cladding layer having arefractive index that is less than the refractive index of the lightpipe by 0.1 or more.

In some embodiments, the optical structure 680 is a reflective lightcollection system. For example, the light collection system may includea reflector such as a circular or eleciptical cone or a CompoundParabolic Concentrator (CPC).

It will be appreciated that that the light emitter 610 and interconnect640 may be encapsulated using an optically transmissive encapsulatingmaterial. FIG. 6 illustrates an example of a cross-sectional side viewof the light source 600 of FIG. 5 having an encapsulating material 700over the light emitter 610 and the optical structure 680 over theencapsulating material. As shown, the gap 690 may be filled by theencapsulating material 700 and the optical structure 680 may be disposedimmediately over and in contact with the encapsulating material 700. Theencapsulating material 700 may protect the light emitter 610 and theinterconnect 640. Non-limiting examples of encapsulating materialsinclude silicone and epoxy resin. In some embodiments, a gap 690 createdby the thickness of the encapsulating material 690 between the lightemitter 610 and the optical structure 680 separates the light emitter640 and the optical structure 680 by about 50 μm or less, about 40 μm orless, or about 10 μm or less or in contact with.

The small separation between the light emitter 640 and the opticalstructure 680 has been found to significantly impact the powerefficiency of light emitters. FIG. 7 is a plot showing the powerefficiency of a light pipe as a function of distance between the lightpipe and a light emitter. The power efficiency is on the y-axis and thedistance between the light pipe and the light emitter is on the x-axis.The power efficiency may be understood to be the percentage of the totalamount of outputted light from the light emitter which is captured andsubsequently outputted by the light pipe. Notably, at distances of 50 μmor less, the power efficiency is 90% or higher, while the powerefficiency falls down steeply at distances of 50 μm or more and, moreparticularly, 100 μm or more. As result, maintaining a gap 690 betweenthe light emitter 610 and the optical structure 680 at distances ofabout 50 μm or less, about 35 μm or less, about 25 μm or less, or about20 μm or less are expected to provide exceptionally high powerefficiency.

In the example above, the transverse dimensions of the light pipe areabout 400×400 um. A light emitter for such a light pipe may fall in therange of about 10×10 um to about 700×700 um. If the light emitter is toosmall, insufficient light is generated to begin with. If the lightemitter is too large and a large proportion of the light misses thelight pipe or reflector system, although the large size makes the systemmore robust to misalignment. As the size of the light collector getsmaller then the gap must be less to keep the efficiency of the system.

Referring both to FIGS. 5 and 6 , as examples, the illustrated lightsource 600 may be similar to the configuration of the light sourceillustrated FIG. 4 . In some other embodiments, the light source 600 mayhave any of the configurations discussed herein, e.g., such as theconfigurations illustrated in FIGS. 2A-3 .

Example Display Systems

It will be appreciated that the low-profile interconnects may beutilized in various illumination applications in which a low profileover the light emitter is desired. As discussed therein, the low profilecan provide tight spacing between the light emitter and an overlyingoptical structure, such as a light pipe. This tight spacing can allowfor highly efficient transfer of light from the light emitter into thelight pipe. Another advantage is that, by eliminating the wire bond, theinterconnect can be more robust against shock and vibration as well asenvironmental concerns. In addition, these interconnects may allow forthe light sources to be placed closer together which can make theoptical system smaller and lighter weight, for a given level of output.Such high efficiency, robustness, and small size may advantageously beutilized in display devices, to increase the brightness and portabilityand/or reduce the power usage of the displays.

In some embodiments, the light emitters may be used to illuminateaugmented or virtual reality display systems. In some embodiments, thesedisplay systems may by wearable and portable, with present images onmultiple depth planes, with light sources required for each depth plane.The high efficiency provided with the low-profile interconnects canadvantageously facilitate the portability of the display system, e.g.,by reducing power requirements and the increasing battery life of powersources and reducing the size for the display system. These concerns maybe particularly important for optical systems that use multiple lightsources for illumination.

With reference to FIG. 8 , an augmented reality scene 1 is depicted. Itwill be appreciated that modern computing and display technologies havefacilitated the development of systems for so called “virtual reality”or “augmented reality” experiences, wherein digitally reproduced imagesor portions thereof are presented to a user in a manner wherein theyseem to be, or may be perceived as, real. A virtual reality, or “VR”,scenario typically involves presentation of digital or virtual imageinformation without transparency to other actual real-world visualinput; an augmented reality, or “AR”, scenario typically involvespresentation of digital or virtual image information as an augmentationto visualization of the actual world around the user. A mixed reality,or “MR”, scenario is a type of AR scenario and typically involvesvirtual objects that are integrated into, and responsive to, the naturalworld. For example, an MR scenario may include AR image content thatappears to be blocked by or is otherwise perceived to interact withobjects in the real world.

FIG. 8 shows an example of an AR scene in which a user of an ARtechnology sees a real-world park-like setting 1100 featuring people,trees, buildings in the background, and a concrete platform 1120. Inaddition to these items, the user of the AR technology also perceivesthat he “sees” a robot statue 1110 standing upon the real-world platform1120, and a cartoon-like avatar character 1130 flying by which seems tobe a personification of a bumble bee, even though these elements 1130,1110 do not exist in the real world. Because the human visual perceptionsystem is complex, it is challenging to produce a VR or AR technologythat facilitates a comfortable, natural-feeling, rich presentation ofvirtual image elements amongst other virtual or real-world imageryelements.

FIG. 9 illustrates an example of wearable display system 80. The displaysystem 80 includes a display 62, and various mechanical and electronicmodules and systems to support the functioning of that display 62. Thedisplay 62 may be coupled to a frame 64, which is wearable by a displaysystem user or viewer 60 and which is configured to position the display62 in front of the eyes of the user 60. The display may be consideredeyewear in some embodiments. In some embodiments, a speaker 66 iscoupled to the frame 64 and positioned adjacent the ear canal of theuser 60 (in some embodiments, another speaker, not shown, is positionedadjacent the other ear canal of the user to provide for stereo/shapeablesound control). In some embodiments, the display system may also includeone or more microphones or other devices to detect sound. In someembodiments, the microphone is configured to allow the user to provideinputs or commands to the system 80 (e.g., the selection of voice menucommands, natural language questions, etc.) and/or may allow audiocommunication with other persons (e.g., with other users of similardisplay systems).

With continued reference to FIG. 9 , the display 62 is operativelycoupled 68, such as by a wired lead or wireless connectivity, to a localdata processing module 70 which may be mounted in a variety ofconfigurations, such as fixedly attached to the frame 64, fixedlyattached to a helmet or hat worn by the user, embedded in headphones, orotherwise removably attached to the user 60 (e.g., in a backpack-styleconfiguration, in a belt-coupling style configuration). The localprocessing and data module 70 may comprise a hardware processor, as wellas digital memory, such as non-volatile memory (e.g., flash memory orhard disk drives), both of which may be utilized to assist in theprocessing, caching, and storage of data. The data include data a)captured from sensors (which may be, e.g., operatively coupled to theframe 64 or otherwise attached to the user 60), such as image capturedevices (such as cameras), microphones, inertial measurement units,accelerometers, compasses, GPS units, radio devices, and/or gyros;and/or b) acquired and/or processed using remote processing module 72and/or remote data repository 74, possibly for passage to the display 62after such processing or retrieval. The local processing and data module70 may be operatively coupled by communication links 76, 78, such as viaa wired or wireless communication links, to the remote processing module72 and remote data repository 74 such that these remote modules 72, 74are operatively coupled to each other and available as resources to thelocal processing and data module 70. In some embodiments, the localprocessing and data module 70 may include one or more of the imagecapture devices, microphones, inertial measurement units,accelerometers, compasses, GPS units, radio devices, and/or gyros. Insome other embodiments, one or more of these sensors may be attached tothe frame 64, or may be standalone structures that communicates with thelocation processing and data module 70 by wired or wirelesscommunication pathways.

With continued reference to FIG. 9 , in some embodiments, the remoteprocessing module 72 may comprise one or more processors configured toanalyze and process data and/or image information. In some embodiments,the remote data repository 74 may comprise a digital data storagefacility, which may be available through the internet or othernetworking configuration in a “cloud” resource configuration. In someembodiments, the remote data repository 74 may include one or moreremote servers, which provide information, e.g., information forgenerating augmented reality content, to the local processing and datamodule 70 and/or the remote processing module 72. In some embodiments,all data is stored and all computations are performed in the localprocessing and data module, allowing fully autonomous use from a remotemodule.

The perception of an image as being “three-dimensional” or “3-D” may beachieved by providing slightly different presentations of the image toeach eye of the viewer. FIG. 10 illustrates a conventional displaysystem for simulating three-dimensional imagery for a user. Two distinctimages 5, 7—one for each eye 4, 6—are outputted to the user. The images5, 7 are spaced from the eyes 4, 6 by a distance 10 along an optical orz-axis parallel to the line of sight of the viewer. The images 5, 7 areflat and the eyes 4, 6 may focus on the images by assuming a singleaccommodated state. Such systems rely on the human visual system tocombine the images 5, 7 to provide a perception of depth for thecombined image.

It will be appreciated, however, that the human visual system is morecomplicated and providing a realistic perception of depth is morechallenging. For example, many viewers of conventional “3-D” displaysystems find such systems to be uncomfortable or may not perceive asense of depth at all. Without being limited by theory, it is believedthat viewers of an object may perceive the object as being“three-dimensional” due to a combination of vergence and accommodation.Vergence movements (i.e., rolling movements of the pupils toward or awayfrom each other to converge the lines of sight of the eyes to fixateupon an object) of the two eyes relative to each other are closelyassociated with focusing (or “accommodation”) of the lenses of the eyes.Under normal conditions, a change in vergence of the eyes when shiftingattention from one object to another object at a different distance willautomatically cause a matching change in the focus of the lenses of theeyes, or accommodation of the eyes, under a relationship known as the“accommodation-vergence reflex.” Likewise, a change in accommodationwill trigger a matching change in vergence, under normal conditions. Asnoted herein, many stereoscopic or “3-D” display systems display a sceneusing slightly different presentations (and, so, slightly differentimages) to each eye such that a three-dimensional perspective isperceived by the human visual system. Such systems are uncomfortable formany viewers, however, since they, among other things, simply provide adifferent presentations of a scene, but with the eyes viewing all theimage information at a single accommodated state, and work against the“accommodation-vergence reflex.” Display systems that provide a bettermatch between accommodation and vergence may form more realistic andcomfortable simulations of three-dimensional imagery.

FIG. 11 illustrates aspects of an approach for simulatingthree-dimensional imagery using multiple depth planes. Objects atvarious distances from eyes 4, 6 on the z-axis are accommodated by theeyes 4, 6 so that those objects are in focus. The eyes (4 and 6) assumeparticular accommodated states to bring into focus objects at differentdistances along the z-axis. Consequently, a particular accommodatedstate may be said to be associated with a particular one of depth planes14, with has an associated focal distance, such that objects or parts ofobjects in a particular depth plane are in focus when the eye is in theaccommodated state for that depth plane. In some embodiments,three-dimensional imagery may be simulated by providing differentpresentations of an image for each of the eyes 4, 6, and also byproviding different presentations of the image corresponding to each ofthe depth planes. While shown as being separate for clarity ofillustration, it will be appreciated that the fields of view of the eyes4, 6 may overlap, for example, as distance along the z-axis increases.It will addition, while shown as flat for ease of illustration, it willbe appreciated that the contours of a depth plane may be curved inphysical space, such that all features in a depth plane are in focuswith the eye in a particular accommodated state.

The distance between an object and the eye 4 or 6 can also change theamount of divergence of light from that object, as viewed by that eye.FIGS. 12A-12C illustrates relationships between distance and thedivergence of light rays. The distance between the object and the eye 4is represented by, in order of decreasing distance, R1, R2, and R3. Asshown in FIGS. 12A-12C, the light rays become more divergent as distanceto the object decreases. As distance increases, the light rays becomemore collimated. Stated another way, it may be said that the light fieldproduced by a point (the object or a part of the object) has a sphericalwavefront curvature, which is a function of how far away the point isfrom the eye of the user. The curvature increases with decreasingdistance between the object and the eye 4. Consequently, at differentdepth planes, the degree of divergence of light rays is also different,with the degree of divergence increasing with decreasing distancebetween depth planes and the viewer's eye 4. While only a single eye 4is illustrated for clarity of illustration in FIGS. 12A-12C and otherfigures herein, it will be appreciated that the discussions regardingeye 4 may be applied to both eyes 4 and 6 of a viewer.

Without being limited by theory, it is believed that the human eyetypically can interpret a finite number of depth planes to provide depthperception. Consequently, a highly believable simulation of perceiveddepth may be achieved by providing, to the eye, different presentationsof an image corresponding to each of these limited number of depthplanes. The different presentations may be separately focused by theviewer's eyes, thereby helping to provide the user with depth cues basedon the accommodation of the eye required to bring into focus differentimage features for the scene located on different depth plane and/orbased on observing different image features on different depth planesbeing out of focus.

FIG. 13 illustrates an example of a waveguide stack for outputting imageinformation to a user. A display system 1000 includes a stack ofwaveguides, or stacked waveguide assembly, 178 that may be utilized toprovide three-dimensional perception to the eye/brain using a pluralityof waveguides 182, 184, 186, 188, 190. In some embodiments, the displaysystem 1000 is the system 80 of FIG. 9 , with FIG. 13 schematicallyshowing some parts of that system 80 in greater detail. For example, thewaveguide assembly 178 may be part of the display 62 of FIG. 9 . It willbe appreciated that the display system 1000 may be considered a lightfield display in some embodiments.

With continued reference to FIG. 13 , the waveguide assembly 178 mayalso include a plurality of features 198, 196, 194, 192 between thewaveguides. In some embodiments, the features 198, 196, 194, 192 may belens. The waveguides 182, 184, 186, 188, 190 and/or the plurality oflenses 198, 196, 194, 192 may be configured to send image information tothe eye with various levels of wavefront curvature or light raydivergence. Each waveguide level may be associated with a particulardepth plane and may be configured to output image informationcorresponding to that depth plane. Image injection devices 200, 202,204, 206, 208 may function as a source of light for the waveguides andmay be utilized to inject image information into the waveguides 182,184, 186, 188, 190, each of which may be configured, as describedherein, to distribute incoming light across each respective waveguide,for output toward the eye 4. These light sources may be made moreefficient and may be spaced closer together using the interconnectsdisclosed herein. By using different sources the light sourcesthemselves act to switch depth planes by switching on or off theillumination for each depth plane, as desired. Light exits an outputsurface 300, 302, 304, 306, 308 of the image injection devices 200, 202,204, 206, 208 and is injected into a corresponding input surface 382,384, 386, 388, 390 of the waveguides 182, 184, 186, 188, 190. In someembodiments, the each of the input surfaces 382, 384, 386, 388, 390 maybe an edge of a corresponding waveguide, or may be part of a majorsurface of the corresponding waveguide (that is, one of the waveguidesurfaces directly facing the world 144 or the viewer's eye 4). In someembodiments, a single beam of light (e.g. a collimated beam) may beinjected into each waveguide to output an entire field of clonedcollimated beams that are directed toward the eye 4 at particular angles(and amounts of divergence) corresponding to the depth plane associatedwith a particular waveguide. In some embodiments, a single one of theimage injection devices 200, 202, 204, 206, 208 may be associated withand inject light into a plurality (e.g., three) of the waveguides 182,184, 186, 188, 190.

In some embodiments, the image injection devices 200, 202, 204, 206, 208are discrete displays that each produce image information for injectioninto a corresponding waveguide 182, 184, 186, 188, 190, respectively. Insome other embodiments, the image injection devices 200, 202, 204, 206,208 are the output ends of a single multiplexed display which may, e.g.,pipe image information via one or more optical conduits (such as fiberoptic cables) to each of the image injection devices 200, 202, 204, 206,208. It will be appreciated that the image information provided by theimage injection devices 200, 202, 204, 206, 208 may include light ofdifferent wavelengths, or colors (e.g., different component colors, asdiscussed herein).

In some embodiments, the light injected into the waveguides 182, 184,186, 188, 190 is provided by a light output module 209 a, which mayinclude a light source, such as the light source 600 (FIGS. 2A-4 ). Thelight from the light output module 209 a may be modified by a lightmodulator 209 b, e.g., a spatial light modulator. The light modulator209 b may be configured to change the perceived intensity of the lightinjected into the waveguides 182, 184, 186, 188, 190. Examples ofspatial light modulators include liquid crystal displays (LCD),including a liquid crystal on silicon (LCOS), and a digital lightprocessing (DLP) displays. While not illustrated, it will be appreciatedthat various other optical structures (e.g., polarizing beam splitters)may be provided between the light output module 209 a and the lightmodulator 209 b to direct the propagation of light as desired tofacilitate the propagation of light from the light output module 209A tothe light modulator 209B and from the light modulator 209B to thewaveguides 182, 184, 186, 188, 190.

In some embodiments, the light output module 209 a may include multiplelight collectors 680, e.g., light pipes or reflectors, as shown in FIG.15 . Each light collector 680 may be configured to output light (e.g.,by transmitting and/or reflecting the light) into the light modulator209 b (FIG. 13 ). These light pipes or reflectors 680 may each beoptically coupled with one or more associated light sources 600 arrangedin patterns on the substrate 630 (e.g., a printed circuit board) and thelow-profile interconnects according to some embodiments mayadvantageously be employed to provide electrical connections in theselight sources 600. In some embodiments, the light emitters 610 (FIG. 5 )of the light sources 600 may be smaller than 1.5×1.5 mm, or smaller than800×800 um or smaller than 300×300 um in some embodiments. As discussedherein, for these smaller sized light emitters, a given distance betweenthe collectors 680 and the light emitter has a more significant impacton the amount of light collected by the light collector 680 then forlarger light emitters. Also, where multiple light sources 600 areemployed, the impact of the efficiency of light collection caused by thecloseness between the light collectors 680 and the light emitters ofeach light source 600 are magnified, since the multiple light sources600 will see the impact of low efficiency light collection in theaggregate. Advantageously, light sources 600 with the low-profileinterconnects disclosed herein can provide a higher light collectionefficiency, which may be particularly beneficial where multiple lightsources 600 are employed. The light output module 209 a may also includea housing and baffles (not shown) for, respectively, enclosing andpreventing light leakage between light collectors 680 and between lightsources 600.

With reference again to FIG. 13 , a controller 210 controls theoperation of one or more of the stacked waveguide assembly 178,including operation of the image injection devices 200, 202, 204, 206,208, the light emitter 209 a, and the light modular 209 b. In someembodiments, the controller 210 is part of the local data processingmodule 70. The controller 210 includes programming (e.g., instructionsin a non-transitory medium) that regulates the timing and provision ofimage information to the waveguides 182, 184, 186, 188, 190 accordingto, e.g., any of the various schemes disclosed herein. In someembodiments, the controller may be a single integral device, or adistributed system connected by wired or wireless communicationchannels. The controller 210 may be part of the processing modules 70 or72 (FIG. 9 ) in some embodiments.

With continued reference to FIG. 13 , the waveguides 182, 184, 186, 188,190 may be configured to propagate light within each respectivewaveguide by total internal reflection (TIR). The waveguides 182, 184,186, 188, 190 may each be planar or have another shape (e.g., curved),with major top and bottom surfaces and edges extending between thosemajor top and bottom surfaces. In the illustrated configuration, thewaveguides 182, 184, 186, 188, 190 may each include outcoupling opticalelements 282, 284, 286, 288, 290 that are configured to extract lightout of a waveguide by redirecting the light, propagating within eachrespective waveguide, out of the waveguide to output image informationto the eye 4. Extracted light may also be referred to as outcoupledlight and the outcoupling optical elements light may also be referred tolight extracting optical elements. An extracted beam of light isoutputted by the waveguide at locations at which the light propagatingin the waveguide strikes a light extracting optical element. Theoutcoupling optical elements 282, 284, 286, 288, 290 may, for example,be gratings, including diffractive optical features, as discussedfurther herein. While illustrated disposed at the bottom major surfacesof the waveguides 182, 184, 186, 188, 190 for ease of description anddrawing clarity, in some embodiments, the outcoupling optical elements282, 284, 286, 288, 290 may be disposed at the top and/or bottom majorsurfaces, and/or may be disposed directly in the volume of thewaveguides 182, 184, 186, 188, 190, as discussed further herein. In someembodiments, the outcoupling optical elements 282, 284, 286, 288, 290may be formed in a layer of material that is attached to a transparentsubstrate to form the waveguides 182, 184, 186, 188, 190. In some otherembodiments, the waveguides 182, 184, 186, 188, 190 may be a monolithicpiece of material and the outcoupling optical elements 282, 284, 286,288, 290 may be formed on a surface and/or in the interior of that pieceof material.

With continued reference to FIG. 13 , as discussed herein, eachwaveguide 182, 184, 186, 188, 190 is configured to output light to forman image corresponding to a particular depth plane. For example, thewaveguide 182 nearest the eye may be configured to deliver collimatedlight, as injected into such waveguide 182, to the eye 4. The collimatedlight may be representative of the optical infinity focal plane. Thenext waveguide up 184 may be configured to send out collimated lightwhich passes through the first lens 192 (e.g., a negative lens) beforeit can reach the eye 4; such first lens 192 may be configured to createa slight convex wavefront curvature so that the eye/brain interpretslight coming from that next waveguide up 184 as coming from a firstfocal plane closer inward toward the eye 4 from optical infinity.Similarly, the third up waveguide 186 passes its output light throughboth the first 192 and second lenses before reaching the eye 4; thecombined optical power of the first 192 and second 194 lenses may beconfigured to create another incremental amount of wavefront curvatureso that the eye/brain interprets light coming from the third waveguide186 as coming from a second focal plane that is even closer inwardtoward the person from optical infinity than was light from the nextwaveguide up 184.

The other waveguide layers 188, 190 and lenses 196, 198 are similarlyconfigured, with the highest waveguide 190 in the stack sending itsoutput through all of the lenses between it and the eye for an aggregatefocal power representative of the closest focal plane to the person. Tocompensate for the stack of lenses 198, 196, 194, 192 whenviewing/interpreting light coming from the world 144 on the other sideof the stacked waveguide assembly 178, a compensating lens layer 180 maybe disposed at the top of the stack to compensate for the aggregatepower of the lens stack 198, 196, 194, 192 below. Such a configurationprovides as many perceived focal planes as there are availablewaveguide/lens pairings. Both the outcoupling optical elements of thewaveguides and the focusing aspects of the lenses may be static (i.e.,not dynamic or electro-active). In some alternative embodiments, eitheror both may be dynamic using electro-active features.

7 In some embodiments, two or more of the waveguides 182, 184, 186, 188,190 may have the same associated depth plane. For example, multiplewaveguides 182, 184, 186, 188, 190 may be configured to output imagesset to the same depth plane, or multiple subsets of the waveguides 182,184, 186, 188, 190 may be configured to output images set to the sameplurality of depth planes, with one set for each depth plane. This canprovide advantages for forming a tiled image to provide an expandedfield of view at those depth planes.

With continued reference to FIG. 13 , the outcoupling optical elements282, 284, 286, 288, 290 may be configured to both redirect light out oftheir respective waveguides and to output this light with theappropriate amount of divergence or collimation for a particular depthplane associated with the waveguide. As a result, waveguides havingdifferent associated depth planes may have different configurations ofoutcoupling optical elements 282, 284, 286, 288, 290, which output lightwith a different amount of divergence depending on the associated depthplane. In some embodiments, the light extracting optical elements 282,284, 286, 288, 290 may be volumetric or surface features, which may beconfigured to output light at specific angles. For example, the lightextracting optical elements 282, 284, 286, 288, 290 may be volumeholograms, surface holograms, and/or diffraction gratings. In someembodiments, the features 198, 196, 194, 192 may not be lenses; rather,they may simply be spacers (e.g., cladding layers and/or structures forforming air gaps).

In some embodiments, the outcoupling optical elements 282, 284, 286,288, 290 are diffractive features that form a diffraction pattern, or“diffractive optical element” (also referred to herein as a “DOE”).Preferably, the DOE's have a sufficiently low diffraction efficiency sothat only a portion of the light of the beam is deflected away towardthe eye 4 with each intersection of the DOE, while the rest continues tomove through a waveguide via total internal reflection. The lightcarrying the image information is thus divided into a number of relatedexit beams that exit the waveguide at a multiplicity of locations andthe result is a fairly uniform pattern of exit emission toward the eye 4for this particular collimated beam bouncing around within a waveguide.

In some embodiments, one or more DOEs may be switchable between “on”states in which they actively diffract, and “off” states in which theydo not significantly diffract. For instance, a switchable DOE maycomprise a layer of polymer dispersed liquid crystal, in whichmicrodroplets comprise a diffraction pattern in a host medium, and therefractive index of the microdroplets can be switched to substantiallymatch the refractive index of the host material (in which case thepattern does not appreciably diffract incident light) or themicrodroplet can be switched to an index that does not match that of thehost medium (in which case the pattern actively diffracts incidentlight).

FIG. 14 shows an example of exit beams outputted by a waveguide. Onewaveguide is illustrated, but it will be appreciated that otherwaveguides in the waveguide assembly 178 may function similarly, wherethe waveguide assembly 178 includes multiple waveguides. Light 400 isinjected into the waveguide 182 at the input surface 382 of thewaveguide 182 and propagates within the waveguide 182 by TIR. At pointswhere the light 400 impinges on the DOE 282, a portion of the lightexits the waveguide as exit beams 402. The exit beams 402 areillustrated as substantially parallel but, as discussed herein, they mayalso be redirected to propagate to the eye 4 at an angle (e.g., formingdivergent exit beams), depending on the depth plane associated with thewaveguide 182. It will be appreciated that substantially parallel exitbeams may be indicative of a waveguide with outcoupling optical elementsthat outcouple light to form images that appear to be set on a depthplane at a large distance (e.g., optical infinity) from the eye 4. Otherwaveguides or other sets of outcoupling optical elements may output anexit beam pattern that is more divergent, which would require the eye 4to accommodate to a closer distance to bring it into focus on the retinaand would be interpreted by the brain as light from a distance closer tothe eye 4 than optical infinity.

Various example embodiments of the invention are described herein.Reference is made to these examples in a non-limiting sense. They areprovided to illustrate more broadly applicable aspects of the invention.Various changes may be made to the invention described and equivalentsmay be substituted without departing from the spirit and scope of theinvention. For example, while advantageously utilized with AR displaysthat provide images across multiple depth planes, the augmented realitycontent disclosed herein may also be displayed by systems that provideimages on a single depth plane. In addition, while advantageouslyapplied as a light source for display systems, the light sourcesdisclosed herein may be utilized in other applications where closespacing of the light emitter to other structures is desired.

In some embodiments, with reference to FIGS. 2A-6 , the electricalcontact may be omitted and a second contact (not shown) to the lightemitter 610 may be made using a second interconnect (not shown) similarto the interconnect 640. For example, the second interconnect may bedeposited over the substrate to contact a second light emitter bond pad(not shown) on an exposed surface of the light emitter 610 (e.g., on anupward-facing surface of the light emitter, opposite from the bond pad650) and a second substrate bond pad (not shown) on the substrate 630.The second interconnect may be deposited by similar methods as the firstinterconnect 640 and, in some embodiments, a dielectric layer (notshown) similar to the dielectric layer 670 may be formed beforedepositing the second interconnect.

Many modifications may be made to adapt a particular situation,material, composition of matter, process, process act(s) or step(s) tothe objective(s), spirit or scope of the present invention. Further, aswill be appreciated by those with skill in the art that each of theindividual variations described and illustrated herein has discretecomponents and features which may be readily separated from or combinedwith the features of any of the other several embodiments withoutdeparting from the scope or spirit of the present inventions. All suchmodifications are intended to be within the scope of claims associatedwith this disclosure.

The invention includes methods that may be performed using the subjectdevices. The methods may comprise the act of providing such a suitabledevice. Such provision may be performed by the user. In other words, the“providing” act merely requires the user obtain, access, approach,position, set-up, activate, power-up or otherwise act to provide therequisite device in the subject method. Methods recited herein may becarried out in any order of the recited events that is logicallypossible, as well as in the recited order of events.

Example aspects of the invention, together with details regardingmaterial selection and manufacture have been set forth above. As forother details of the present invention, these may be appreciated inconnection with the above-referenced patents and publications as well asgenerally known or appreciated by those with skill in the art. The samemay hold true with respect to method-based aspects of the invention interms of additional acts as commonly or logically employed.

In addition, though the invention has been described in reference toseveral examples optionally incorporating various features, theinvention is not to be limited to that which is described or indicatedas contemplated with respect to each variation of the invention. Variouschanges may be made to the invention described and equivalents (whetherrecited herein or not included for the sake of some brevity) may besubstituted without departing from the spirit and scope of theinvention. In addition, where a range of values is provided, it isunderstood that every intervening value, between the upper and lowerlimit of that range and any other stated or intervening value in thatstated range, is encompassed within the invention.

Also, it is contemplated that any optional feature of the inventivevariations described may be set forth and claimed independently, or incombination with any one or more of the features described herein.Reference to a singular item, includes the possibility that there areplural of the same items present. More specifically, as used herein andin claims associated hereto, the singular forms “a,” “an,” “said,” and“the” include plural referents unless the specifically stated otherwise.In other words, use of the articles allow for “at least one” of thesubject item in the description above as well as claims associated withthis disclosure. It is further noted that such claims may be drafted toexclude any optional element. As such, this statement is intended toserve as antecedent basis for use of such exclusive terminology as“solely,” “only” and the like in connection with the recitation of claimelements, or use of a “negative” limitation.

Without the use of such exclusive terminology, the term “comprising” inclaims associated with this disclosure shall allow for the inclusion ofany additional element-irrespective of whether a given number ofelements are enumerated in such claims, or the addition of a featurecould be regarded as transforming the nature of an element set forth insuch claims. Except as specifically defined herein, all technical andscientific terms used herein are to be given as broad a commonlyunderstood meaning as possible while maintaining claim validity.

The breadth of the present invention is not to be limited to theexamples provided and/or the subject specification, but rather only bythe scope of claim language associated with this disclosure.

What is claimed is:
 1. A display system, comprising: a substratecomprising a substrate bond pad; a light emitter attached to thesubstrate, the light emitter comprising a light emitter bond pad andhaving horizontal and vertical surfaces; an electrical interconnect overthe light emitter, the electrical interconnect contacting the lightemitter bond pad at one end of the electrical interconnect andcontacting the substrate bond pad at an other end of the electricalinterconnect, wherein across-sectional shape of the electricalinterconnect, as viewed in a plane transverse to an elongate axis of theelectrical interconnect, has a width larger than a height of thecross-sectional shape, and wherein the electrical interconnectconformally follows and mimics a contour defined by the vertical andhorizontal surfaces of the light emitter; a light pipe over an exposedsurface of the light emitter; and a spatial light modulator configuredto receive light from the light pipe and to modulate the light to defineimages.
 2. The display system of claim 1, wherein a maximum height ofthe electrical interconnect above the light emitter is 50 μm or less. 3.The display system of claim 1, wherein the electrical interconnectconformally follows contours of the light emitter.
 4. The display systemof claim 3, wherein the light emitter defines a step over the substrate,wherein the electrical interconnect follows contours of the step.
 5. Thedisplay system of claim 1, wherein the cross-sectional shape isrectangular.
 6. The display system of claim 1, wherein the electricalinterconnect comprises a metal.
 7. The display system of claim 1,wherein the light emitter is a LED chip.
 8. The display system of claim1, wherein the substrate is a printed circuit board.
 9. The displaysystem of claim 1, further comprising a dielectric layer between thelight emitter and the electrical interconnect.
 10. The display system ofclaim 1, wherein the light emitter further comprises an other lightemitter bond pad, and an other electrical interconnect contacting theother light emitter bond pad at one end of the other electricalinterconnect and contacting an other substrate bond pad at an other endof the electrical interconnect, wherein a cross-sectional shape of theother electrical interconnect, as viewed in a plane traverse to anelongate axis of the electrical interconnect, has a width larger than aheight.
 11. The display system of claim 1, further comprising: a lightmodulating device configured to receive light from the light pipe; and astack of waveguides, each waveguide comprising a light incouplingoptical element configured to receive light from the light modulatingdevice.
 12. The display system of claim 11, further comprising aplurality of the light pipes, each light pipe configured to transmitlight to the light modulating device.
 13. The display system of claim 1,further comprising a reflector over an exposed surface of the lightemitter.
 14. The display system of claim 13, further comprising: a lightmodulating device configured to receive light from the reflector; and awaveguide comprising a light incoupling optical element configured toreceive light from the light modulating device.
 15. The display systemof claim 14, wherein the waveguide includes a stack of waveguidesconfigured to receive light from the light modulating device.
 16. Thedisplay system of claim 14, further comprising a plurality of thereflectors, each reflector configured to direct light to the lightmodulating device.
 17. A method for making an display device,comprising: providing a substrate comprising a substrate bond pad;attaching a light emitter to the substrate, the light emitter comprisinga light emitter bond pad and having horizontal and vertical surfaces;depositing an electrical interconnect over the light emitter, theelectrical interconnect contacting the light emitter bond pad at one endof the electrical interconnect and contacting the substrate bond pad atan other end of the electrical interconnect, wherein across-sectionalshape of the electrical interconnect, as viewed in a plane transverse toan elongate axis of the electrical interconnect, has a width larger thana height of the cross-sectional shape, and wherein the electricalinterconnect conformally follows and mimics a contour defined by thevertical and horizontal surfaces of the light emitter; and providing alight pipe over an exposed surface of the light emitter; and providing aspatial light modulator configured to receive light from the light pipeand to modulate the light to define images.
 18. The method of claim 17,wherein depositing the electrical interconnect comprises 3D printing theelectrical interconnect.
 19. The method of claim 17, further comprisingdepositing a dielectric material over the light emitter beforedepositing the electrical interconnect.
 20. The method of claim 17,wherein depositing the dielectric material comprises 3D print thedielectric material.